Chipmakers must improve the performance of their products - LPKF has the
solution

EQS-News: LPKF Laser & Electronics SE / Key word(s): Market Report
Chipmakers must improve the performance of their products - LPKF has the
solution

13.05.2024 / 09:35 CET/CEST
The issuer is solely responsible for the content of this announcement.

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Chipmakers must improve the performance of their products - LPKF has the
solution

Garbsen, 13 May 2024 - The miniaturization of micro-chips is gradually
reaching its physical limits. Chip manufacturers are forced to find new ways
to further improve system performance and meet the ever-increasing
requirements of technologies such as generative AI. In this context, the
immediate vicinity of the chip is increasingly coming into focus and several
renowned players have now announced a paradigm shift: glass as a substrate
material for Advanced Packaging. This has set the industry in motion. LPKF's
LIDE technology (Laser Induced Deep Etching) is ready to enable this
transition from ramp-up to high volume manufacturing.

Advanced packaging with glass substrates
Today, Advanced Packaging is a strategically important discipline in chip
manufacturing. It enables chip architects to connect highly integrated chips
more tightly together. With glass substrates instead of organic or silicon
substrates, even more chiplets can be packed into one system. The systems
become faster, take up less space and consume less power.

"The notion that glass is an ideal substrate material is not exactly new,
but it used to be very difficult to process in a quality that these fields
of application require," says Roman Ostholt, Managing Director Electronics
at LPKF and key developer of LIDE. "With LIDE, glass substrates from 100µm
up to 1.1mm can be processed quickly, precisely, and without damage," he
adds.

High process maturity of LIDE technology
"Our technology has reached an excellent level of maturity and can meet the
high requirements of the semiconductor industry", says Klaus Fiedler, CEO of
LPKF. "We have increased our production capacities for LIDE at our
headquarters in Garbsen/Hannover in order to meet growing customer demand".
The high level of process maturity and the proof of operational performance
have already convinced global players to work with LPKF's technology. "Our
customers appreciate the precision and flexibility we can offer, and they
are particularly impressed by the new design possibilities which LIDE opens
up for them", says Ostholt.

Industry experts assume that the transformation of the semiconductor
industry to high volume manufacturing of glass-based packages will take
place in the second half of this decade. LPKF is ready to drive this change
forward with its outstanding know-how and equipment solutions.

For more information please visit: https://lide.lpkf.com/de

About LPKF
LPKF Laser & Electronics SE is a leading provider of laser-based solutions
for the technology industry. LPKF laser systems are of crucial importance to
the production of printed circuit boards, microchips, automotive parts,
solar modules and a large number of other components. Founded in 1976, the
company is headquartered in Garbsen near Hanover and operates worldwide via
subsidiaries and representative offices. The shares of LPKF Laser &
Electronics SE are traded in the Prime Standard segment of Deutsche Börse
(ISIN 0006450000).

Contact:
Bettina Schäfer, Senior Manager Investor Relations & Corporate Communication
Investorrelations@lpkf.com


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13.05.2024 CET/CEST Dissemination of a Corporate News, transmitted by EQS
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The issuer is solely responsible for the content of this announcement.

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   Language:       English
   Company:        LPKF Laser & Electronics SE
                   Osteriede 7
                   30827 Garbsen
                   Germany
   Phone:          +49 (0) 5131 7095-0
   Fax:            +49 (0) 5131 7095-95
   E-mail:         investorrelations@lpkf.com
   Internet:       www.lpkf.com
   ISIN:           DE0006450000
   WKN:            645000
   Listed:         Regulated Market in Frankfurt (Prime Standard);
                   Regulated Unofficial Market in Berlin, Dusseldorf,
                   Hamburg, Munich, Stuttgart, Tradegate Exchange
   EQS News ID:    1901291

End of News EQS News Service
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1901291 13.05.2024 CET/CEST