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EQS-News: LPKF Laser & Electronics SE / Key word(s): Market Report
Chipmakers must improve the performance of their products - LPKF has the solution
2024-05-13 / 09:35 CET/CEST
The issuer is solely responsible for the content of this announcement.
Chipmakers must improve the performance of their products - LPKF has the solution
Garbsen, 13 May 2024 - The miniaturization of micro-chips is gradually reaching its physical limits. Chip manufacturers
are forced to find new ways to further improve system performance and meet the ever-increasing requirements of
technologies such as generative AI. In this context, the immediate vicinity of the chip is increasingly coming into
focus and several renowned players have now announced a paradigm shift: glass as a substrate material for Advanced
Packaging. This has set the industry in motion. LPKF's LIDE technology (Laser Induced Deep Etching) is ready to enable
this transition from ramp-up to high volume manufacturing.
Advanced packaging with glass substrates
Today, Advanced Packaging is a strategically important discipline in chip manufacturing. It enables chip architects to
connect highly integrated chips more tightly together. With glass substrates instead of organic or silicon substrates,
even more chiplets can be packed into one system. The systems become faster, take up less space and consume less power.
"The notion that glass is an ideal substrate material is not exactly new, but it used to be very difficult to process
in a quality that these fields of application require," says Roman Ostholt, Managing Director Electronics at LPKF and
key developer of LIDE. "With LIDE, glass substrates from 100µm up to 1.1mm can be processed quickly, precisely, and
without damage," he adds.
High process maturity of LIDE technology
"Our technology has reached an excellent level of maturity and can meet the high requirements of the semiconductor
industry", says Klaus Fiedler, CEO of LPKF. "We have increased our production capacities for LIDE at our headquarters
in Garbsen/Hannover in order to meet growing customer demand".
The high level of process maturity and the proof of operational performance have already convinced global players to
work with LPKF's technology. "Our customers appreciate the precision and flexibility we can offer, and they are
particularly impressed by the new design possibilities which LIDE opens up for them", says Ostholt.
Industry experts assume that the transformation of the semiconductor industry to high volume manufacturing of
glass-based packages will take place in the second half of this decade. LPKF is ready to drive this change forward with
its outstanding know-how and equipment solutions.
For more information please visit: https://lide.lpkf.com/de
About LPKF
LPKF Laser & Electronics SE is a leading provider of laser-based solutions for the technology industry. LPKF laser
systems are of crucial importance to the production of printed circuit boards, microchips, automotive parts, solar
modules and a large number of other components. Founded in 1976, the company is headquartered in Garbsen near Hanover
and operates worldwide via subsidiaries and representative offices. The shares of LPKF Laser & Electronics SE are
traded in the Prime Standard segment of Deutsche Börse (ISIN 0006450000).
Contact:
Bettina Schäfer, Senior Manager Investor Relations & Corporate Communication
Investorrelations@lpkf.com
2024-05-13 CET/CEST Dissemination of a Corporate News, transmitted by EQS News - a service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
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Language:     English 
Company:      LPKF Laser & Electronics SE 

Osteriede 7
30827 Garbsen
Germany

Phone:        +49 (0) 5131 7095-0 
Fax:          +49 (0) 5131 7095-95 
E-mail:       investorrelations@lpkf.com 
Internet:     www.lpkf.com 
ISIN:         DE0006450000 
WKN:          645000 
Listed:       Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, 

Hamburg, Munich, Stuttgart, Tradegate Exchange
EQS News ID: 1901291

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1901291 2024-05-13 CET/CEST

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END) Dow Jones Newswires

May 13, 2024 03:35 ET (07:35 GMT)