ARMONK (dpa-AFX) - International Business Machines Corp. (IBM) on Friday
announced that it has signed an agreement with the Government of Canada and the
Government of Quebec to invest up to C$187 million in advancing chip packaging
capacity and capabilities at IBM Canada's Bromont semiconductor plant.

The investment aims to strengthen research and development activities at the
plant.

IBM's Bromont facility will focus on enhancing assembly, testing, and packaging
capabilities for semiconductor modules used in various applications such as
telecommunications, high-performance computing, automotive, aerospace and
defense, computer networks, and generative AI.

The agreements also facilitate collaborations with small and medium-sized
Canadian enterprises to support the development of a semiconductor ecosystem.



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