SUSS MicroTec presents hybrid bonding all-rounder XBC300 Gen2 D2W/W2W

EQS-News: SÜSS MicroTec SE / Key word(s): Product Launch
SUSS MicroTec presents hybrid bonding all-rounder XBC300 Gen2 D2W/W2W

13.05.2024 / 09:00 CET/CEST
The issuer is solely responsible for the content of this announcement.

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* W2W, collective D2W and sequential D2W on a single platform

  * New solution allows parallel development of different hybrid bonding
    processes

  * Up to 40 percent space saving compared to stand-alone D2W or W2W hybrid
    bonders

* Bonder specialist SET contributes ultra-high-precision die bonder


Garching, May 13, 2024 - SÜSS MicroTec SE, a leading manufacturer of system
and process solutions for the semiconductor industry, presents a world
novelty: the first hybrid bonding all-rounder. The integrated platform
XBC300 Gen2 D2W/W2W covers the complete range of current process
technologies for hybrid bonding on 200 mm and 300 mm substrates. It enables
wafer-to-wafer (W2W) as well as collective and sequential die-to-wafer (D2W)
bonding.

Thanks to its versatility, different hybrid bonding processes can be
developed and qualified in parallel, making the XBC300 Gen2 D2W/W2W
perfectly tailored to the needs of research facilities and development
departments of semiconductor manufacturers. Compared to stand-alone W2W or
D2W hybrid bonders, the XBC300 Gen2 D2W/W2W requires up to 40 percent less
space. It is therefore a particularly efficient and footprint-optimized
solution for testing hybrid bonding methods and preparing them for
high-volume production.

'Semiconductor manufacturers have to evaluate individually for each
application which hybrid bonding technology leads to better process results.
With our innovative solution, we provide them with a single tool to evaluate
the best bonding process in each case. Our new solution is therefore the
optimal flexible platform for the subsequent commissioning of independent
W2W or D2W hybrid bonders with high throughput for large volumes,' says
Markus Ruff, Head of Product Line Bonder at SUSS MicroTec.

Hybrid bonding is a key technology for stacking multiple microchips
(chiplets) on top of each other, known as 3D integration. On top of
increasing the functionality of each individual chip, the overall
performance is significantly boosted. This development is driven by
applications such as autonomous driving, high-performance computing (HPC),
artificial intelligence (AI) and, last but not least, the increasing
expansion of 5G applications, which require more and more bandwidth while
simultaneously improving energy efficiency. 'Hybrid bonding will determine
how and when the world's major technology players can turn their innovation
projects into concrete new products and solutions,' says Markus Ruff.

SÜSS MicroTec SE is expanding its hybrid bonding portfolio with the XBC300
Gen2 D2W/W2W. Prior to the integrated solution, the company has already
introduced the W2W hybrid bonder XBS300, which is currently being evaluated
by a leading global foundry in Asia. The new platform is the result of a
technology partnership with SET Corporation SA. The French specialist for
flip-chip bonders is contributing the ultra-precision die bonder to the
XBC300 Gen2 D2W/W2W.

In parallel, SUSS MicroTec is developing an independent D2W hybrid bonding
solution for high-volume mass production. The ultra-precision die bonder
from SET will also be used in this solution. Following the installation of a
first pilot system at SUSS MicroTec's application center in Sternenfels in
the fourth quarter of 2023, numerous customer demonstrations are scheduled
for the near future.

'With dedicated D2W and W2W hybrid bonding solutions as well as the combined
D2W/W2W platform, we are building a unique product portfolio to ensure our
customers have the best possible support for all hybrid bonding
applications. In addition, we are the only provider to offer a complete D2W
hybrid bonding solution, which includes sales and installation as well as
service and support. We stand for innovative solutions from a single
source,' says Dr. Robert Wanninger, Senior Vice President Advanced Backend
Solutions at SUSS MicroTec.

More information about the XBC300 Gen2 D2W/W2W:
https://www.suss.com/en/products-solutions/wafer-bonder/xbc300-gen2-d2w-w2w


Media contact:
Jutta Schreiner
E-mail: marcom@suss.com
Tel.: +49 89 32007395

Investor contact:
Franka Schielke
E-mail: franka.schielke@suss.com
Tel.: +49 89 32007161

About SUSS MicroTec

SUSS MicroTec is a leading supplier of equipment and process solutions for
microstructuring in the semiconductor industry and related markets. In close
cooperation with research institutes and industry partners SUSS MicroTec
contributes to the advancement of next-generation technologies such as 3D
integration and nanoimprint lithography as well as key processes for MEMS
and LED manufacturing. With a global infrastructure for applications and
service SUSS MicroTec supports more than 8.000 installed systems worldwide.
SUSS MicroTec is headquartered in Garching near Munich, Germany. The shares
of SÜSS MicroTec SE are traded in the Prime Standard of the German Stock
Exchange (ISIN DE000A10K0235). For more information, please visit
http://www.suss.com.


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The issuer is solely responsible for the content of this announcement.

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   Language:       English
   Company:        SÜSS MicroTec SE
                   Schleissheimer Strasse 90
                   85748 Garching
                   Germany
   Phone:          +49 (0)89 32007-161
   Fax:            +49 (0)89 4444 33420
   E-mail:         franka.schielke@suss.com
   Internet:       www.suss.com
   ISIN:           DE000A1K0235
   WKN:            A1K023
   Indices:        SDAX, TecDax
   Listed:         Regulated Market in Frankfurt (Prime Standard);
                   Regulated Unofficial Market in Berlin, Dusseldorf,
                   Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange
   EQS News ID:    1899755

End of News EQS News Service
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1899755 13.05.2024 CET/CEST