ARMONK (dpa-AFX) - Rapidus Corporation, a manufacturer of advanced logic
semiconductors, and multinational technology company IBM (IBM) have joined
forces to pioneer mass production technologies for chiplet packages.

Under the agreement, Rapidus will receive packaging technology from IBM for
high-performance semiconductors, and the two companies will collaborate with a
goal of further innovating in this space.

The agreement is part of an international collaboration within the framework of
the 'Development of Chiplet and Package Design and Manufacturing Technology for
2nm-Generation Semiconductors' project being conducted by Japan's New Energy and
Industrial Technology Development Organization (NEDO) and builds on an existing
agreement with IBM for the joint development of 2nm node technology.

As part of the agreement, IBM and Rapidus engineers will work in collaboration
at IBM's facilities in North America for R&D and manufacturing of semiconductor
packaging for high-performance computer systems.



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